1. Material Composition & Manufacturing Process GPO-3 (Glass fiber reinforced unsaturated polyester sheet) Base...
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FR-4 Common Thickness Range FR-4 for PCB substrates: 0.2 mm – 3.2 mm (1.6 mm is the most common standard PCB thickne...
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When selecting a phenolic cotton rod (also known as cotton phenolic laminate rod), it’s important to consider the mec...
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What Is the Diamond Pattern Size in DDP? The “diamond pattern” refers to the heat-curable epoxy resin dots printed o...
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Phenolic laminate classification Phenolic laminates are a very important industrial material, and there are many way...
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Bakelite board and phenolic paper board usually refer to the same material, but they are called differently. Bakelite...
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FR4 is the grade name of the most commonly used epoxy glass fiber laminate in the electronics industry. It is not on...
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The oil duct strip (also called insulating support strip or spacer strip) of oil-immersed transformers is a key insul...
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The difference between GPO-3 and G-10 Material The terms GPO-3 and G-10 (or G10) refer to two distinct types of glas...
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Differences Between DMD and DM Insulation Papers in Motors The DMD and DM used in motor insulation papers are ...
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Time:08-19 2025
Time:08-12 2025
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