PCB substrates
Time: 06-22 2026 Auther: Xujue Electrical
The substrate insulation materials of printed circuit boards (PCBs) form the core dielectric layer of copper-clad laminates (CCL). They are primarily used to achieve electrical isolation, mechanical support, and signal dielectric transmission control. Their properties directly determine the thermal resistance, reliability, high-frequency performance, and service life of the PCB.
PCB Insulation Material System Comparison Table
| Insulation Material System | Typical Materials | Material Structure | Insulation Characteristics | Thermal Rating | Key Electrical Properties | Main Applications |
|---|---|---|---|---|---|---|
| Epoxy Resin System | Epoxy Resin PCB | Epoxy resin + glass fiber cloth/paper-based substrate | Balanced performance, good moisture resistance | Tg 130–180°C | Medium dielectric constant, stable | FR-4, industrial control, consumer electronics |
| Phenolic Resin System | Phenolic PCB | Phenolic resin + paper/FR-4 paper composite | Basic insulation performance, low cost | 105–130°C | Higher dielectric loss | FR-1 / FR-2, low-end electronics |
| Polyimide System | Polyimide PCB | Polyimide film/resin | High insulation, radiation resistance, extremely high reliability | 200–260°C | Low loss, high stability | FPC, aerospace, high-reliability electronics |
| PTFE System | PTFE PCB | PTFE + ceramic fillers | Ultra-low dielectric loss, extremely high insulation | — | Stable Dk, extremely low Df | 5G communications, RF, microwave circuits |
| Glass Fiber Reinforced System | Glass Fiber PCB | E-glass fiber | High mechanical strength, excellent dimensional stability | 130–180°C | Stable dielectric performance | FR-4 core reinforcement structure |
| Polyester Film System | PET PCB | PET / PEN film | Flexible, low cost | 120–150°C | Moderate electrical performance | Flexible electronics, low-cost FPC |
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